High-Performance 4-Layer PCB Solutions with F4BTMS1000 Material for Demanding Applications

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)

Introduction to F4BTMS1000:

The F4BTMS series represents an advanced iteration of the F4BTM series, featuring significant breakthroughs in material formulation and manufacturing processes. This high-reliability material is enriched with a substantial amount of ceramics and reinforced with ultra-thin, ultra-fine glass fiber cloth, resulting in enhanced performance and a broader range of dielectric constants. It is particularly suitable for aerospace applications and can effectively replace comparable foreign products.

By incorporating a carefully balanced mix of ultra-thin glass fiber cloth and specially distributed nano-ceramics combined with polytetrafluoroethylene resin, the negative impacts of glass fiber on electromagnetic wave propagation are minimized. This innovation reduces dielectric loss, enhances dimensional stability, and decreases anisotropy in the X/Y/Z axes. Additionally, it improves electrical strength, thermal conductivity, and exhibits excellent low thermal expansion characteristics.

Properties of F4BTMS1000:

Dielectric Constant (Dk): 10.2 at 10 GHz
Dissipation Factor: 0.0020 at 10 GHz, 0.0023 at 20 GHz
Coefficient of Thermal Expansion (CTE):
X-axis: 16 ppm/°C
Y-axis: 18 ppm/°C
Z-axis: 32 ppm/°C (from -55°C to 288°C)
Low Thermal Coefficient of Dk: -320 ppm/°C (from -55°C to 150°C)
High Thermal Conductivity: 0.81 W/mK
Low Moisture Absorption: 0.03%

PCB Construction Details:

Specification	Details
Base Material	F4BTMS1000
Layer Count	4 layers
Board Dimensions	145mm x 145mm (± 0.15mm)
Minimum Trace/Space	5/7 mils
Minimum Hole Size	1.2mm
Blind Vias	Top to Inner Layer 1; Buried: Inner Layer 2 to Inner Layer 3
Finished Board Thickness	12.9mm
Finished Copper Weight	1 oz (1.4 mils) for inner and outer layers
Via Plating Thickness	20 µm
Surface Finish	HASL (Hot Air Solder Leveling)
Top Silkscreen	White
Bottom Silkscreen	No
Top Solder Mask	Black
Bottom Solder Mask	No
Electrical Testing	100% Electrical Testing conducted prior to shipment

PCB Stackup:

Copper Layer 1: 35 µm
F4BTMS1000 Core: 6.35 mm (250 mil)
Copper Layer 2: 35 µm
Prepreg RO4450F: 0.102 mm (4 mil)
Copper Layer 3: 35 µm
F4BTMS1000 Core: 6.35 mm (250 mil)
Copper Layer 4: 35 µm

PCB Statistics:

Components: 19
Total Pads: 77
Through Hole Pads: 35
Top SMT Pads: 42
Bottom SMT Pads: 0
Vias: 32
Nets: 2

Artwork and Standards Information

Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide

Typical Applications:

Aerospace equipment and cabin systems
Microwave and RF applications
Military radar systems
Feed networks
Phase-sensitive and phased array antennas
Satellite communications and more